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v310i
V310i Advanced 3D Solder Paste Inspection System (SPI) solution.The V310i Series offers powerful technologies and high throughput productivity for SMT production line.
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V310i: Advanced 3D Solder Paste Inspection System (SPI)
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  • Details
  • Specifications

V310i Advanced 3D Solder Paste Inspection System (SPI) solution.
The V310i Series offers powerful technologies and high throughput productivity for SMT production line.

Board Dimensions

V310i

Maximum board size (Single Lane)

-

Maximum board size

510 mm by 510 mm (20 inch by 20 inch) with 2 projectors

Minimum board size

50 mm by 50 mm (2 inch by 2 inch)

Maximum board thickness

4 mm (0.16 inch)

Minimum board thickness

0.5 mm (0.02 inch)

Board weight

Up to 3kg (6.6lb)

Maximum inspected area

503 mm by 510 mm (19.8 inch by 20 inch) with 2 projectors

Clearance

Top side of board

15 mm (0.6 inch)

Bottom side of board

50 mm (1.96 inch)

Minimum edge clearance

3.5 mm (0.14 inch)

Maximum PCB Warpage

±5mm

Conveyor height range

856 mm to 965 mm (33.7 inch to 37.9 inch)

System Dimensions

Footprint

W: 1060 mm (3.5 ft) x D: 1352 mm (4.4 ft) x H: 2028 mm (6.7 ft)

Weight

~750 kgs



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